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Description
Features:
- Thermal paste for various heat sink applications. - Silicone based compound with Metal Oxide. - Thermal conductivity of more than 4.8 W/M-K - 1g tube suitable for a 1-2 applications. - Stable performance with negligible electrical conductivity.
Description:
This thermal paste is suitable for heatsinks found in game consoles, computers and other heat generating electrical devices.
The compound comes in a syringe package which allows control when applying the paste to the appropriate areas.
Operating temperature -50 to 240 degrees centigrade.
The tube provides approximately 1-2 applications and has a cap to reseal.
Old paste should be removed, and area cleaned thoroughly before applying new paste, in order to gain best performance. Although electrical conductivity is very low, excess paste should be cleaned off of PCBs.
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