Features:- Direct heat rework template for Nintendo Wii GPU CPU BGA.
- Includes 4 pieces.
- For 0.6 solder balls (0.50mm for CPU).
- Recommended for use by experienced engineers only.
Description:A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults.
DIY part. This is a DIY part for you to fit yourself. Fitting needs care and, where stated, soldering or other technical skills – see our
fitting guides. We're not responsible for damage caused by incorrect fitting, or for an existing fault in your console. Replacing a part may not fix your fault, as faults can have more than one cause. This doesn't affect your statutory rights.
Safety information:
- Not a toy. Keep out of reach of children.
- Small parts – choking hazard.
- Soldering required – ventilate, beware hot iron.
- Sharp points or edges – handle and store with care.
- Fits listed models only – do not force.
- Fitting guides: zedlabz.com/blogs/guides
Manufacturer: Assecure Ltd (ZedLabz), The Outbuildings, Grove Farm Road, Maldon, Essex, CM9 8LR, UK · support@zedlabz.com
EU responsible person (for authorities only): FFB Estonia OÜ · Päevalille tn 6-15, Haabersti linnaosa, 13517 Tallinn, Harju maakond, Estonia · finance_estonia@fulfillment-box.com
