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APU GPU BGA reballing Stencil set for Nintendo Wii rework template replacement - 4 peice | ZedLabz

ZedLabz

APU GPU BGA reballing Stencil set for Nintendo Wii rework template replacement - 4 peice | ZedLabz

Regular price £5.77

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Features:

- Direct heat rework template for Nintendo Wii GPU CPU BGA.
- Includes 4 pieces.
- For 0.6 solder balls (0.50mm for CPU).
- Recommended for use by experienced engineers only.

Description:

A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults. 




Platform Wii
Colour Silver
Manufacturer ZedLabz
EAN 5056026434393
SKU 700514
Weight 15g