Features:
- Thermal paste for various heat sink applications.
- Metal based compound containing metal oxide.
- Thermal conductivity of more than 1.93 W/m-K.
- 15.g tube approx 4-6 application - resealable syringe.
- Stable performance with negligible electrical conductivity.
Description: This metal based thermal compound from Startech helps to maximise heat dissipation from CPUs, GPUs and other heat generating components that utilise a head sink / exhaust.
It provides higher performance than standard silicone based thermal pastes, ideal for compact devices.
The tube provides approximately 4-6 applications and has a cap to reseal the syringe for future use.
Old paste should be removed before applying new paste, the paste has extremely low levels of electrical conductivity but it is recommended to avoid getting any paste on the PCB.
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