Features:- Chip Quik TC3-1G silicone-based thermal compound
- 1g syringe with dispensing tips
- Fills the gap between chip and heatsink to improve heat transfer
- Non-conductive silicone formula
- Suits console CPUs/GPUs, voltage regulators and handheld repaste jobs
Description:Chip Quik TC3 is a silicone-based thermal compound supplied in a handy 1g syringe. It is used between a hot chip and its heatsink to fill microscopic gaps and move heat away more effectively.
A 1g syringe is enough for a few small applications, such as repasting a games console processor, a voltage regulator or a handheld. Clean off the old compound first, apply a thin layer and refit the heatsink.
The compound is non-conductive, which makes it a safe choice around small components.
Safety information:
- Not a toy. Keep out of reach of children.
- Small parts – choking hazard.
- Follow the safety information on the manufacturer’s packaging.
- Avoid contact with eyes and skin; wash hands after use.
- Use in a well-ventilated area.
Manufacturer: Chip Quik. UK importer: Assecure Ltd (ZedLabz), The Outbuildings, Grove Farm Road, Maldon, Essex, CM9 8LR, UK · support@zedlabz.com
EU responsible person (for authorities only): FFB Estonia OÜ · Päevalille tn 6-15, Haabersti linnaosa, 13517 Tallinn, Harju maakond, Estonia · finance_estonia@fulfillment-box.com
